SS600 series is new generation of
high-performance epoxy encapsulation material, in
which SS610 is hot adhesive; SS620 is cold adhesive.
It features as stable storage, even flow, high-temperature
curing within short time. After curing, it has stable
performance, strong cohesive force, hard and elastic.
It is specially used for soft sealing of IC and other
electronic crystals, suitable for the bonding sealing
of new computer, communication, automated product,
game machine, toy, etc.
