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SUPERBONDER® SMA
SUPERBONDER® surface mount adhesive is epoxy resin electronic special adhesive specifically prepared as per performance and quality requirement of high-speed Dispensing and large amount of stencil printing by PCB manufacturers.
SUPERBONDER® 2068 is fluid with high viscosity and high thixotropic property, suitable for both syringe dispensing and stencil printing; SUPERBONDER®2081 is fluid with low viscosity and high thixotropic property, specifically for stencil printing. This SMA has the following properties:
  1. Consistent high dot profile;
  2. Excellent green strength;
  3. Fast curing;
  4. 6 month shelf life at refrogerator;
  5. High thixotropic index;
  6. Non-slumping or non-stringing.
Typical feature before curing
Feature Test value
Composition Epoxy resin
Density (ASTM D792,c/cc) 1.20
Viscosity [ASTM d1824(RTV SPINDLE #7)] 2,560,000
386,000
Color Red
Thixotropic index (ASTM D1824) 6.3
Dot form (w/h) <2.0
Storage period [month@5°C(41°F)] 6.0
Lap shear strength [ASTM D1002 psi(Al/Al@25°C(77°F)] 1,400
Vitrification point [ASTM D696, Tg(by TMA)] 137°C
Coefficient of thermal expansion [ASTM D696(by TMA)]
alpha1 48×10-6
170×10-6
alpha2
Typical feature after curing
Feature Test value
Insulating strength (ASTM D149 volts/mil) 420
dielectric constant (ASTM D150@ 1MHz) 3.15
Dielectric loss factor (ASTM D150@ 1Mhz) 0.022
volume specific resistance (ASTM D257 ohmcm) 2.2×1016
Surface resistance (ASTM D257 ohmsq/cm) 1.1×1015
Curing condition (IR or Convection Ovens)
  • 150sec @ 150°C(302°F)
Color
  • This product has red and yellow colors for customer to select
Cleaning
  • Non-cured adhesive can be washed from PCB with isopropyl alcohol.
Packing
  • 300ml cartridge
Storage and use
  • This SMA is stored under the cold storage (5°C) condition. Its service life can be extended.
  • The dispensing nozzle should be cleaned with solvent (e.g. isopropyl alcohol) before use.
  • The SMA after cold storage should be restored to the room temperature before use.
   
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