| Features of SUPERSOLDER®
Solder Paste:
1. Solder powder is in ball form, with even distribution
of particle;
2. Total oxygen content of the solder powder (adsorption
oxygen and moisture) is very low;
3. Chemical composition is accurate, and alloy solder
powder has high purity. Chemical composition and impurity
elements have reached US QQ-S-57 and Japan JIS-Z-3282
Class A standard;
4. The quality is excellent, and soldering ability
is high;
5. Clean free product has very few residual materials,
with good printability, stability and viscosity.
Recommended solder reflow curve: (Take Sn63/Pb37
as an example)
The following is the temperature curve adopted for
the hot air solder reflow as recommended by us, which
can be used as the reference for the temperature setting
of the solder reflow furnace. This temperature curve
can effectively reduce the solder paste vertical flow
and generation of tin ball, applicable for most of
products and process conditions.
| Product type |
Product name |
Product spec |
Melting point ℃ |
Printing time (h) |
Type |
Packing form |
Remark |
| SUPERSOLDER® |
SUPERSOLDER® SSNC101 |
Sn63Pb37 |
183 |
≥10 |
No-Clean |
500g |
General |
| SUPERSOLDER® SSNC102 |
Sn62Pb37Ag2 |
179 |
≥10 |
No-Clean |
500g |
Contain silver |
| SUPERSOLDER® SSNC103 |
Sn96.5Ag3.5 |
221 |
≥8 |
No-Clean |
500g |
Lead free |
| SUPERSOLDER® SSNC104 |
Sn96Ag3.5Cu0.5 |
219 |
≥8 |
No-Clean |
500g |
Lead free |
| Tin
powder particle distribution (optional)
|
| Model |
Mesh code |
Diameter (um) |
Applicable pitch |
| T2 |
-200/+325 |
45-75 |
≥0.65mm(25mil) |
| T2.5 |
-230/+500 |
25-63 |
≥0.65mm(25mil) |
| T3 |
-325/+500 |
25-45 |
≥0.5mm(20mil) |
| T4 |
-400/+500 |
25-38 |
≥0.4mm(16mil) |
| T5 |
-400/+635 |
20-38 |
≤0.4mm(16mil) |
| T6 |
N.A. |
10-30 Micro |
BGA |
|
